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Phenolic resin for electronics and molding

Introduction:

Phenolic resin for electronics is a kind of high purity linear phenolic resin prepared with superior phenol and formaldehyde solution. It has less than 0.1 free phenol and less foreign ion, ideal for the electronics with high thermal resistant, mechanical property, water resistant and size requirements.
Phenolic resin for moulding is a kind of phenolic resin with high strength, good thermal resistant, good flame retardancy, appropriate flowability. The ammonia free resin prepared with special process and strictly controlled catalyst/phenol ratio, can be used in high temperature insulation system for its high thermal stability and high strength, no ammonia emission under high temperature and slow corrosion to metal.

Application:

Phenolic resin for electronics: printed circuit boards, electronic packing materials, CCL, insulation boards, and EMC. Phenolic resin for moulding: living goods, electrical appliances, plastic bobbins, and automobile parts.

Property: 
Phenolic resin for electronics:

Model Free phenol
%
Chromaticity
G
Conductivity
us/cm
Softening point
PF-8010 ≤0.1 ≤2 ≤2.5 96-101
PF-8020 ≤0.1 ≤2 ≤4.5 104-109
PF-8210 ≤0.1 ≤3 ≤3 67-72
PF-8211 ≤0.1 ≤3 ≤3 90-95
PF-8305 ≤0.5 ≤3 ≤10 80-95
PF-8315 ≤0.5 ≤3 ≤10 55-95


(Note: 1. PF 8010 & PF 8020: phenolic resin for electronics; 2. PF 8210 -8211: epoxy curing agent; 3. PF 8315: xylok )

Phenolic resin for moulding:

Model Polymerization time
S/150℃
Flowability
mm
Softening point
Free phenol
%
PF-8203 60-90 30-80 90-100 <5
PF-8204 70-100 40-60 85-95 <1.5
PF-8401 40-60 20-80 80-90 <5
PF-8402 30-50 20-40 80-90 <5


(Note: 1. PF 8204: low phenol moulding; 2. PF 8401 -8402: ammonia free resin )